EVG: A Legacy of Semiconductor Innovation
Founded in Austria in 1980, EVG specializes in developing and manufacturing advanced machinery crucial for the semiconductor, microsystems, and nanotechnology sectors. With all primary research, development, and production consolidated in St. Florian am Inn, Austria, EVG has consistently pioneered groundbreaking technologies.
Notably, in 1985, EVG introduced the world's first double-sided mask aligner with bottom-side microscopes, a pivotal invention that propelled the commercialization of Micro-Electro-Mechanical Systems (“MEMS”) products. The company also revolutionized the chip manufacturing process by inventing sophisticated methods for wafer bonding, a critical step in integrating silicon wafers and their electronic circuits into functional units. More recently, in 2022, EVG unveiled an innovative layer transfer solution for advanced chip fabrication. Employing over 1,600 professionals globally, EVG has received several awards for its innovative contributions and commercial achievements within the semiconductor industry.
Singapore: A Strategic Semiconductor Powerhouse
Singapore has emerged as a powerhouse in high-value industries like semiconductor manufacturing and, more recently, data centers. This strategic focus leverages compact, high-yield industries, making the island nation a critical node in the global chip supply chain. Austria, in particular, plays a significant role in supporting Singapore's semiconductor ambitions, with a substantial portion of its exports to the country comprising machinery and equipment for chip production.
EVG's Expansion in Singapore
In a significant stride to deepen its engagement in Southeast Asia, EVG has established a new entity, “EV Group E. Thallner Singapore Pte. Ltd.”. This expansion marks a substantial investment in local resources, enabling EVG to provide direct, comprehensive support to regional chip manufacturers. This also includes improvements to machine services and optimization of processes for development assistance and specialized training functions.
This new Singapore office builds upon EVG's established operations and existing partnerships, such as with Link Fab Technologies. EVG Singapore will integrate Link Fab's experienced support team and plans to further expand its local workforce.
This strategic move by EVG is believed to have a significant impact on the regional chip industry, boosting collaboration and bringing advanced Austrian technology and expertise to Asia's growing semiconductor manufacturing sector.
